发明名称 STRUCTURING OF ELECTRICAL FUNCTIONAL LAYERS BY MEANS OF A TRANSFER FILM AND STRUCTURING THE ADHESIVE
摘要 The invention relates to a film (66) with at least one electrical component and a method for production of such a film. An adhesive layer of a radiation-curing adhesive is applied to a base film (61). The adhesive is applied to the base film in the structured form of a pattern and/or is irradiated according to a pattern, such that the adhesive hardens in a structured form, according to the pattern. A transfer film (41) is applied to the adhesive layer, comprising a support film and an electrical functional layer. The support film (41) is removed from the base film, the adhesive layer and the film body, comprising the electrical functional layer, whereby the electrical functional layer remains on the base film (61) in a first region, structured in the form of a pattern and, in a second region, structured in the form of a pattern, the electrical functional layer remains on the support film and is removed with the support film from the base film (61).
申请公布号 KR20060125769(A) 申请公布日期 2006.12.06
申请号 KR20067010175 申请日期 2004.10.19
申请人 LEONHARD KURZ GMBH & CO. KG 发明人 WILD HEINRICH;BREHM LUDWIG;HANSEN ACHIM
分类号 B32B37/14;B32B37/12;C09J7/02;H01L21/68;H01L51/40 主分类号 B32B37/14
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