| 摘要 |
A thick copper printed circuit board(PCB) and a method for manufacturing the same are provided to reduce a manufacturing cost and time, and improve reliability of a PCB by filling and drying a filler into a circuit gap and forming a second circuit where a copper plating is performed after drilling a penetration hole. A method for manufacturing a thick copper PCB includes the steps of: manufacturing a substrate(30) by inserting and compressing an insulation layer(20) between a copper thin film(10); perforating a plurality of guide holes on four corners of the copper thin film(10) and the insulation layer(20); eroding a first circuit GAP on the copper thin film(10) which forms an upper/lower part of the substrate(30); filling a filler(50) into the first circuit GAP of the copper thin film(10); performing a planarization of a surface of the copper thin film(10) which the filler(50) is filled into the first circuit GAP; forming a hole(60) which penetrates an upper/lower part of the substrate(30); forming a plating layer which plates the penetration hole(60) and the upper/lower part of the substrate(30); forming a second circuit which erodes a second circuit GAP on an upper part of the plating layer; and processing a surface of the plated substrate and processing an outer shape.
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