| 摘要 |
Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.
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