摘要 |
A radiation-sensitive resin composition comprising (A) a resin comprising at least two recurring units of the formulas (1)-(6) in the total amount of 5-70 mol %, but each in the amount of 1-49 mol %, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. wherein R<SUP>1 </SUP>is a hydrogen or methyl and R<SUP>2 </SUP>is a substituted or unsubstituted alkyl group having 1-4 carbon atoms. The resin composition is useful as a chemically amplified resist having high transmittance of radiation, sensitivity, resolution, dry etching resistance, and pattern profile.
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