发明名称 AN ELECTRON BEAM CURING APPARATUS
摘要 <p>An electron beam curing apparatus is provided to cure simultaneously an entire area of a photoresist layer on a wafer by arranging a plurality of tips at a predetermined interval on a semiconductor substrate. A plurality of tips(120) are projected from a lower side of a semiconductor substrate(110) in order to emit electron beams for providing on a wafer on which a photoresist layer is formed. An extractor electrode(140) is used for accelerating the electron beams emitted from the tips. An anode electrode(160) is used for focusing the accelerated electron beams. An aperture plate(180) includes a plurality of apertures through which the electron beams pass. A plurality of deflectors(200) are used for deflecting the electron beams.</p>
申请公布号 KR20060123790(A) 申请公布日期 2006.12.05
申请号 KR20050045341 申请日期 2005.05.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HAK
分类号 H01L21/027 主分类号 H01L21/027
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