发明名称 MEMS COMPRISING PLANARIZATION LAYER AND METHOD THEREOF
摘要 An MEMS(Micro Electro Mechanical System) structure including a planarization layer and a method thereof are provided to precisely etch a sacrificial layer formed on both sidewalls by accurately controlling a sacrificial layer removing process by using the planarization layer. A method for manufacturing an MEMS(Micro Electro Mechanical System) structure includes the steps of: depositing an insulation layer(220) on a substrate(210); forming a groove corresponding to a predetermined pattern and a support unit surrounding the groove by etching the insulation layer; depositing a sacrificial layer on the insulation layer; flattening the sacrificial layer to expose the support unit; depositing a planarization layer(230) on the support unit and the sacrificial layer; depositing a laminated structure on the planarization layer; forming a hole on the planarization layer and the laminated structure; and removing the sacrificial layer through the hole by using an etchant.
申请公布号 KR20060124211(A) 申请公布日期 2006.12.05
申请号 KR20050046021 申请日期 2005.05.31
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SUN HO
分类号 B81C1/00 主分类号 B81C1/00
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