发明名称 |
MEMS COMPRISING PLANARIZATION LAYER AND METHOD THEREOF |
摘要 |
An MEMS(Micro Electro Mechanical System) structure including a planarization layer and a method thereof are provided to precisely etch a sacrificial layer formed on both sidewalls by accurately controlling a sacrificial layer removing process by using the planarization layer. A method for manufacturing an MEMS(Micro Electro Mechanical System) structure includes the steps of: depositing an insulation layer(220) on a substrate(210); forming a groove corresponding to a predetermined pattern and a support unit surrounding the groove by etching the insulation layer; depositing a sacrificial layer on the insulation layer; flattening the sacrificial layer to expose the support unit; depositing a planarization layer(230) on the support unit and the sacrificial layer; depositing a laminated structure on the planarization layer; forming a hole on the planarization layer and the laminated structure; and removing the sacrificial layer through the hole by using an etchant.
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申请公布号 |
KR20060124211(A) |
申请公布日期 |
2006.12.05 |
申请号 |
KR20050046021 |
申请日期 |
2005.05.31 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, SUN HO |
分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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