Mounting apparatus for ball grid array device

摘要

Ball grid array devices are mounted in a burn-in and test socket which has a top surface sockets which have top surfaces with windows for the ball terminals terminal balls depending from the ball grad grid array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals terminal balls. The ends of the contact members are urged into contact with the ball terminals terminal balls between the center of the ball terminal ball and the surface of the ball grid array device, thus retaining the device in the socket.