CLEANER FOR SEMI-CONDUCTOR PACKAGE

摘要

An apparatus for cleaning a semiconductor package is provided to clean a semiconductor package without elevating an air shower nozzle by performing an air cleaning process on the semiconductor package while a magazine in which the semiconductor package is stacked is transferred as the magazine is laid down. A magazine supply part(20) supplies a magazine(10) in which a semiconductor package is vertically stacked in a direction parallel with a bottom surface. A cleaning part(30) injects air to the magazine supplied from the magazine supply part to clean the semiconductor package. A magazine collecting part(40) collects the magazine coming out of the cleaning part. A magazine transfer part(50) transfers the magazine supplied from the magazine supply part to the magazine collecting part via the cleaning part. The magazine is laid down so that the semiconductor package is positioned in parallel with a transfer direction and is vertical to the bottom surface. A foreign substance absorbing unit(60) is installed under the cleaning part to absorb foreign substances separated from the semiconductor package.