| 摘要 |
A tab tape for a tape carrier package is provided to perform signal processing between the tape carrier package and a printed circuit board by preventing corrosion of an Sn plating in an input pattern. In a tab tape for a tape carrier package, a base film(200) includes a device hole(210) on which a driving chip is mounted and slit holes(250,260) dispersing a stress applied to the tape carrier package. An input pattern(230) formed at an upper part of the base film(200) includes a pad, wherein the driving chip is electrically connected to one end of the pad and a connector of a printed circuit board is coupled to the other end of the pad. An output pattern(240) formed at the upper part of the base film(200) includes a pad, wherein the driving chip is connected with one end of the pad and a flat display panel is connected to the other end of the pad. A solder resist layer formed at the upper part of the base film(200) surrounds the input and output patterns(230,240). A region of the pad adjacent to a connector body is formed to be narrower than a region not neighboring to the connector body for preventing a contact with the connector body in a part coupled with the connector of the printed circuit board in case of the input pattern(230). |
