CARRIER FOIL-ATTACHED ELECTROLYTIC COPPER FOIL PROVIDED WITH INSULATION LAYER FORMING RESIN LAYER, COPPER-CLAD LAMINATED SHEET, PRINTED CIRCUIT BOARD, PRODUCTION METHOD FOR MULTILAYER COPPER-CLAD LAMINATED SHEET AND PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD

摘要

A technique of using a copper foil not roughened as a printed circuit board, especially a method using a carrier foil-attached electrolytic copper foil. A carrier foil-attached electrolytic copper foil or the like is used, which is provided with an insulation layer forming resin layer, and which is characterized by being provided on the surface of a carrier foil with a joint interface layer, on the joint interface layer with an electrolytic copper foil layer smooth on the both surfaces thereof, and on the electrolytic copper foil with a resin layer. Resin compositions constituting this resin layer include 20-80 pts.wt. of epoxy resin (including a curing agent), 20-80 pts.wt. of aromatic polyamide resin polymer soluble in a solvent, and a curing accelerator added in a proper amount as needed.