OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING

摘要

According to one exemplary embodiment, an overmolded package (100, 300) includes a component (102, 302) situated on a substrate (114, 314). The overmolded package further includes an overmold (116, 316) situated over the component and the substrate. The overmolded package further includes a wirebond cage (106, 306) situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds (110a, 110b, 310a, 310b). The wirebond cage forms an EM1 shield around the component. According to this exemplary embodiment, the overmolded package hrther includes a conductive layer (108, 308) situated on a top surface (118, 318) of the overmold and connected to the wirebond cage, where the conductive layer forms an EM 1 shield over the component.