发明名称 PROCESS FOR PRODUCING SOLID-PLATED MATERIAL AND THE SOLID-PLATED MATERIAL
摘要 A process for producing a solid-plated material having a coating layer excellent in conductivity and durability. A coating fluid containing an organic binder is mixed with conductive particles for plating and metal particles for binding to prepare a suspension. The suspension is sprayed on core particles which are being centrifugally fluidized to thereby form on the surface of the core particles a coating layer comprising the plating particles and the binding metal particles tenaciously bonded with the organic binder. Thereafter, the core particles are heated to a temperature not lower than the melting point of the binding metal particles to thereby remove the organic binder by pyrolysis and simultaneously melt the binding metal particles. Thus, a fusion-bonded layer containing the plating particles tenaciously bonded can be formed on the surface of the core particles. When particles of a material having excellent conductivity are used as the particles for plating, a solid- plated material having a coating layer excellent in conductivity and durability can be produced.
申请公布号 KR20060123143(A) 申请公布日期 2006.12.01
申请号 KR20067009098 申请日期 2006.05.10
申请人 SINTOBRATOR, LTD. 发明人 HISADA WATARU;TAMAKI KENJI
分类号 B22F1/02;C23C4/18;C23C24/00;C23C24/04;C23C26/02;H01B1/22 主分类号 B22F1/02
代理机构 代理人
主权项
地址