MODULE ELECTRONIQUE FORME DE COMPOSANTS EMPILES ET SOLIDARISES, COMPOSANT, PROCEDE, MOYENS D'ASSEMBLAGE ET MACHINE D'ASSEMBLAGE CORRESPONDANTS

摘要

The module has four stacked components (11-14) e.g. high frequency processing component, microprocessor and memory, each including multiple track portions formed on one of its edges. The components are integrated in an irreversible manner, using a flexible insulation sleeve (31) which provides an electrical connection between the track portions. Each of the components (11, 12, 14) has an electrical connection unit. - Independent claims are also included for the following: - (a) a method for assembling electronic module - (b) a method for maintaining the electronic module - (c) a machine for assembling the electronic modules.