| 摘要 |
According to one embodiment, a semiconductor device includes an interposer board having a rectangular shape, a semiconductor chip provided on a front surface of the interposer board, projecting electrodes provided in a area on a back surface of the interpose board and electrically connected to the semiconductor chip, and auxiliary pins provided in corners of the back surface of the interposer board which corners are located outside the area, the auxiliary pins having a melting point of at least 250° C.
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