| 发明名称 |
In-situ profile measurement in an electroplating process |
| 摘要 |
A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
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| 申请公布号 |
US2006266653(A1) |
申请公布日期 |
2006.11.30 |
| 申请号 |
US20050137711 |
申请日期 |
2005.05.25 |
| 申请人 |
BIRANG MANOOCHER;KOVARSKY NICOLAY Y;DONOSO BERNARDO |
发明人 |
BIRANG MANOOCHER;KOVARSKY NICOLAY Y.;DONOSO BERNARDO |
| 分类号 |
C25D21/12 |
主分类号 |
C25D21/12 |
| 代理机构 |
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