| 摘要 |
PURPOSE: A slug exposure type semiconductor package is provided to be capable of improving reliability and effectively transferring heat. CONSTITUTION: A slug exposure type semiconductor package includes a slug(310) having the first and second surface(310a,310b). At this time, a plurality of dimples and a slug groove are formed at the first surface, and a slug swaging and a rivet hole(314) are formed at the second surface. The slug exposure type semiconductor package further includes a semiconductor chip(320) for enclosing the dimples on the first surface of the slug, inner signal leads arrayed along both sides of the slug in parallel, outer signal leads continuously arrayed to the inner signal leads, a wire for electrically connecting the semiconductor chip with the inner signal leads, and an encapsulation part(340) for selectively enclosing the resultant structure. Preferably, the thickness of the slug is in the range of 0.6-0.9 mm. |
