| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin-based interlayer insulation adhesive exhibiting flame retardancy without a halogen, having excellent heat resistance and preservation stability, and rapidly curable at a high temperature of not lower than 100°C. <P>SOLUTION: The layer insulation adhesive for a multilayer printed wiring board comprises (1) a thermoplastic resin having 10<SP>3</SP>-10<SP>5</SP>weight average molecular weight and containing a sulfur component, (2) an inorganic filler, (3) an epoxy resin having≤500 epoxy equivalent, and (4) an epoxy resin-curing agent as essential components. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
