| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board in which stripping strength of a substrate and a component mounting land can be enhanced drastically and good soldering can be performed with extremely high reliability. SOLUTION: A via is formed directly under a component mounting land formed larger than the soldering area. On the component mounting land, solder resist is removed over an area equal to the soldering area and rides over the periphery of the component mounting land or a part thereof. Overriding amount is set to absorb the slippage for the circuit pattern when the solder resist is formed. COPYRIGHT: (C)2007,JPO&INPIT
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