发明名称 |
MIT BLEIFREIEM LöTMITTEL VERBUNDENE STRUKTUR UND ELEKTRONISCHE VORRICHTUNG |
摘要 |
<p>Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.</p> |
申请公布号 |
DE69836230(D1) |
申请公布日期 |
2006.11.30 |
申请号 |
DE1998636230 |
申请日期 |
1998.12.09 |
申请人 |
HITACHI LTD. |
发明人 |
SHIMOKAWA;SOGA;OKUDAIRA;ISHIDA;NAKATSUKA;INABA, YOSHIHARU;NISHIMURA, ASAO |
分类号 |
B23K1/20;B23K1/00;B23K35/00;B23K35/26;C22C13/02;H01L23/50;H05K3/34 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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