发明名称 CONDUCTIVE CIRCUIT AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a conductive circuit capable of simply forming a conductive circuit formed simply and highly conductive, and forming a highly conductive circuit. SOLUTION: The forming method of a conductive circuit comprises a coated film forming process of forming a conductive coated film by applying a conductive polymer solution on a substrate, and a circuit forming process of forming the conductive circuit by developing the conductive coated film after pattern exposure. The conductive polymer solution containsπ-conjugated system conductive polymer, polyanion, a photosensitive vinyl group containing compound, and a solvent. The photosensitive vinyl group containing compound is one or both of a compound having a vinyl group, a glycidyl group and/or a hydroxy group and a compound having two or more of vinyl groups. The conductive circuit is formed by the forming method of a conductive circuit. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324315(A) 申请公布日期 2006.11.30
申请号 JP20050144028 申请日期 2005.05.17
申请人 SHIN ETSU POLYMER CO LTD 发明人 MASAHIRO YASUSHI;YOSHIDA KAZUYOSHI;NEI HIROMICHI;HIGUCHI YASUSHI;ABE TOSHIKA
分类号 H05K3/02;H01B5/14;H01B13/00;H01L51/50;H05B33/02 主分类号 H05K3/02
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