| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor device manufacturing equipment which can conduct proper positioning of a semiconductor element at a predetermined place on a substrate, at face-up mounting of the semiconductor element at a predetermined place on the substrate. SOLUTION: The semiconductor device manufacturing equipment FA comprises a first holder 10 which can hold and move the semiconductor element 2; second holder 20 which can hold and move the substrate 1; irradiation device 30 which is arranged facing the circuit plane 2A of the semiconductor element 2, and irradiates detection light KL on the circuit plane 2A; photodetector 40 which is so arranged as to face the back face 2B of the semiconductor element 2, and can receive the detection light KL which has passed through the semiconductor element 2; and a controller CONT which detects the positional information about the semiconductor element 2, based on the detection results of the photodetector 40, makes positioning of the semiconductor element 2 and the substrate 1, based on the detected positional information by driving the first holding portion 10 and/or the second holding portion 20, and then connects the back face 2B of the semiconductor element 2 and the front face 1A of the substrate 1. COPYRIGHT: (C)2007,JPO&INPIT
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