| 摘要 |
PROBLEM TO BE SOLVED: To provide a cyanide-free gold-plating solution which makes a plated film form a superior bump shape, possess adequate adhesiveness with a substrate even after the plated film has been heat-treated, and possess adequate hardness for securing the bondability of the bump. SOLUTION: In a gold-plating solution containing sodium gold sulfite or an ethylenediamine complex thereof with a gold concentration of 5 to 20 g/L, sodium sulfite of 10 to 100 g/L and a thallium compound with a thallium concentration of 1 to 50 ppm, this gold-plating solution further includes potassium sulfite of 0.1 to 50 g/L. COPYRIGHT: (C)2007,JPO&INPIT
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