发明名称 METAL PARTICULATE DISPERSION AND METHOD FOR FORMING METAL FILM BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a metal particulate dispersion and a formation method for forming such an excellent metal film by using this metal particulate dispersion as has a uniform thickness and besides none of defects such as pinholes and cracks. SOLUTION: The metal particulate dispersion contains a metal particulate, water, a volatile organic solvent, and a nonvolatile organic compound. The metal particulate used is a particulate containing one or more kinds of metal elements selected from the group consisting of Ag, Au, Pt, Pd, Ru, Sn, Cu, Ni, Fe, Co, Ti, In and Ir. The volatile organic solvent used is a 1-5C saturated aliphatic alcohol. The nonvolatile organic compound is contained in a ratio of two or more parts by weight thereof relative to 100 parts by weight of the metal particulate. The formation method of a metal film comprises coating a metal particulate fluid dispersion on the surface of a substrate, and drying, and thereafter baking. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006321948(A) 申请公布日期 2006.11.30
申请号 JP20050148348 申请日期 2005.05.20
申请人 SUMITOMO ELECTRIC IND LTD 发明人 OKADA KAZUMASA;SHIMODA KOHEI
分类号 C09D1/00;B22F7/04;B22F9/00;C09D5/24;C09D17/00;C23C24/08;H01B1/22;H05K3/12 主分类号 C09D1/00
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