| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition using a polyimide precursor capable of being made into imide at ≤200°C, and usable for rigid and flexible printed circuit boards. <P>SOLUTION: The photosensitive resin composition contains the polyimide precursor having a structure of formula (1) (where R<SP>1</SP>denotes a tetravalent organic group; and R<SP>2</SP>denotes a divalent organic group obtained by removing amino groups from an aliphatic diamine), and a (meth)acrylic compound having a carbon-carbon double bond. <P>COPYRIGHT: (C)2007,JPO&INPIT |
