| 摘要 |
In an optical image acquisition and information transmission system, the system components can be fabricated, according to a first implementation, in a stack positioned on a circuit board. According to a second implementation, the system components are fabricated on a single substrate using the same semiconductor processes for each component. Both implementations result in better performance parameters. These systems are particularly useful as control devices wherein information resulting from processing the acquired image rather than the image itself is transmitted.
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