发明名称 MOLD CLAMPING DEVICE AND MOLD THICKNESS ADJUSTING METHOD
摘要 An object is to provide a mold-clamping apparatus (10) in which the number of parts to be moved in adjusting mold thickness is reduced to thereby exhibit enhanced accuracy in adjusting mold thickness. The mold-clamping apparatus (10) includes a first stationary member to which a stationary mold (15) is attached; a first movable member disposed in opposition to the first stationary member and to which a movable mold (16) is attached; and a second movable member to be advanced and retreated in association with advancement and retreat of the first movable member. Mold thickness is adjusted by means of changing relative positions of the first movable member and the second movable member; thus, the number of parts to be moved in adjusting mold thickness can be reduced, whereby accuracy in adjusting mold thickness can be enhanced.
申请公布号 EP1726426(A1) 申请公布日期 2006.11.29
申请号 EP20050721120 申请日期 2005.03.18
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 TOKUI, YOSUKE;MORITANI, KOUJI
分类号 B29C45/66;B29C33/22;B29C45/17 主分类号 B29C45/66
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