SIDE-EMITTING LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF

摘要

A side-emitting light emitting diode and a fabricating method thereof are provided to reduce remarkably thickness of a wall of an LED by forming the wall of the LED with a substrate. A concave part(108) is formed on a semiconductor substrate. A lower metal layer(102) and an upper metal layer(104) are formed on both sides of the semiconductor substrate. A second upper metal layer(112a) is used for covering a wall face of concave part and the first upper metal layer. An LED chip(120) is disposed within the concave part. A transparent sealing part(130) is used for sealing the LED chip. A first and a second upper metal layer assembly are divided into two isolated parts to form an electrode. The LED chip is electrically connected with the electrode.