| 摘要 |
An apparatus and a method for controlling the temperature of a substrate during substrate processing. The apparatus comprises a substrate table having a thermal surface supporting the substrate. The apparatus also comprises a first thermal assembly arranged in the substrate table and comprising a plurality of thermoelectric modules, each of the plurality of thermoelectric modules having a thermoelectric surfaces such that the plurality of thermoelectric modules defines a plurality of thermoelectric surfaces. In this apparatus, the plurality of thermoelectric surfaces is in thermal communication with the thermal surface and includes various shapes of thermoelectric surfaces, and the plurality of thermoelectric surfaces is configured to substantially completely underlie the thermal surface. The method comprises controlling a temperature of the thermal surface with a plurality of thermoelectric modules, the plurality of thermoelectric modules defining a plurality of thermoelectric surfaces and the plurality of thermoelectric surfaces including various shapes of thermoelectric surfaces.
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