发明名称 Heat dissipating device and method for manufacturing it
摘要 A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.
申请公布号 US7142426(B2) 申请公布日期 2006.11.28
申请号 US20040015984 申请日期 2004.12.17
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 WANG GEN-CAI;ZHAO DI-QIONG;FANG YI-CHYNG
分类号 H05K7/20 主分类号 H05K7/20
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