| 摘要 |
An apparatus and method for bending glass substrate(s) are provided. Microwave radiation is used to heat glass substrate(s) for bending. As a result, a coating supported by the substrate(s) is not heated as much during the bending process compared to if only conventional IR radiation was used. Thus, more extreme degrees of glass bending may be achieved, and/or the likelihood of coating damage reduced.
|
