发明名称 |
METHOD OF DEPOSITING THIN FILM USING POLARITY TREATMENT |
摘要 |
A method for depositing a thin film by using polarization is provided to adjust a degree that a precursor is absorbed on the surface of a semiconductor substrate along a stepped portion according to polarity of the precursor by performing a hydrophilic or hydrophobic polarization treatment on the surface of the semiconductor substrate. After the surface of a semiconductor substrate having a stepped portion is polarized, An absorption layer of a first precursor is formed on the substrate. The absorption layer of the first precursor reacts with a second precursor to deposit a thin film. An Al-containing organic or inorganic compound is used as the first precursor and an O-containing organic or inorganic compound is used as the second precursor so that an Al2O3 thin film is deposited.
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申请公布号 |
KR100653214(B1) |
申请公布日期 |
2006.11.27 |
申请号 |
KR20050115223 |
申请日期 |
2005.11.30 |
申请人 |
INTEGRATED PROCESS SYSTEMS LTD. |
发明人 |
LEE, KI HOON;SEO, TAE WOOK |
分类号 |
H01L27/108;H01L21/8242 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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