发明名称 METHOD OF DEPOSITING THIN FILM USING POLARITY TREATMENT
摘要 A method for depositing a thin film by using polarization is provided to adjust a degree that a precursor is absorbed on the surface of a semiconductor substrate along a stepped portion according to polarity of the precursor by performing a hydrophilic or hydrophobic polarization treatment on the surface of the semiconductor substrate. After the surface of a semiconductor substrate having a stepped portion is polarized, An absorption layer of a first precursor is formed on the substrate. The absorption layer of the first precursor reacts with a second precursor to deposit a thin film. An Al-containing organic or inorganic compound is used as the first precursor and an O-containing organic or inorganic compound is used as the second precursor so that an Al2O3 thin film is deposited.
申请公布号 KR100653214(B1) 申请公布日期 2006.11.27
申请号 KR20050115223 申请日期 2005.11.30
申请人 INTEGRATED PROCESS SYSTEMS LTD. 发明人 LEE, KI HOON;SEO, TAE WOOK
分类号 H01L27/108;H01L21/8242 主分类号 H01L27/108
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