MIRROR PACKAGE AND METHOD OF MANUFACTURING THE MIRROR PACKAGE

摘要

A mirror package and a method of manufacturing the same are provided to block external radiation of reflection beam by freely controlling the thickness of input and output holes to be blocked. A laser beam is incident from the outside. A mirror structure reflects the laser beam to an external screen according to an image signal. An isotropy etch process is implemented on a silicon wafer(100). An input hole(110) and an output hole(120) for the laser beam are formed on the silicon wafer. A wafer module is formed by bonding the silicon wafer, a glass wafer, and a mirror wafer. The silicon wafer surface where the input and output holes are formed is attached to the glass wafer.