| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounted component removal device for printed wiring boards removing a surface-mounted component for a printed wiring board on which surface mounted components are mounted without unnecessarily heating the concerned surface mount component and surface mounted components around the concerned surface mount component, and also to provide the printed wiring board to which the surface mounted component removal device is applicable. SOLUTION: The surface mounted component removal device 1 is configured with a heating tip 11, through-holes 52 penetrated between upper and lower sides of the printed wiring board 5 are formed to a soldering pattern foil 51 of one surface mounted component 6 on the printed wiring board 5, a heating tip 11 is inserted to the through-hole 52 of the concerned surface mounted component 6 on the printed wiring board 5 from the side opposite to the mounting side of the surface mounted component on the printed wiring board 5, a tip side of the heating tip 11 is in contact with solder 7 soldering the connection terminal 61 of the surface-mounting component 6 and the soldering pattern foil 51 to heat and melt the solder 7, thereby removing the surface mounted component 6. COPYRIGHT: (C)2007,JPO&INPIT
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