| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for manufacturing an electronic component package which is connected through a fine conductor formed by using a transfer die. <P>SOLUTION: The process for manufacturing an electronic component package comprises a step for filling the recess 110 in a transfer die 100 having a profile of two steps or more with a conductive material 140, a step for forming a conductor 160 through hardening/contraction of the conductive material 140 thus forming a space 170 in the recess 110, a step for filling the space 170 with first insulating resin 180, a step for aligning the connection terminal of a wiring board with the recess 110 in the transfer die 100 and bringing first insulating resin 180 into semi-cured state, a step for stripping the transfer die 100 and forming second insulating resin on the surface of the wiring board where the conductor 160 is formed, and a step for aligning the electrode terminal of an electronic component with the conductor 160 while facing each other, connecting the connection terminal and the electrode terminal through the conductor 160 and further curing the second insulating resin. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
