发明名称 FLEX-RIGID SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To obtain a flex-rigid substrate capable of improving a durability against an excess stress such a tear. SOLUTION: Circuit patterns 5 are formed on the surfaces of base films 4, and flexible substrates 2 are constituted so that the circuit patterns 5 are coated with protective films 3. The rigid substrates 1 are laminated on parts of the flexible substrates 2, and the width ends of the flexible substrates 2 exposed from the rigid substrates 1 are constituted so that the base films 4 are exposed from the protective films 3. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006319197(A) 申请公布日期 2006.11.24
申请号 JP20050141498 申请日期 2005.05.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIOKA KENGO;NAGAMINE TAKAHIRO;KOYAMA MASATO
分类号 H05K3/46;H05K3/28 主分类号 H05K3/46
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