MATERIAL FOR FORMING INSULATING FILM WITH LOW DIELECTRIC CONSTANT

摘要

PROBLEM TO BE SOLVED: To improve the mechanical strength of an insulating film with low dielectric constant made of a porous film. SOLUTION: A solution for forming the insulating film with low dielectric constant comprises a silicon resin 2, fine particles 3 principally composed of a silicon atom and an oxygen atom and having a large number of pores, and a solvent 4. COPYRIGHT: (C)2007,JPO&INPIT