发明名称 |
Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes |
摘要 |
The electronic module has a support (40) which has contact tracks (46,48,50) formed on its underside. The microcircuit module (56) is fixed to the top side of the support and has output connectors (60,62) each connected to one of the tracks on the underside of the support. The connections between the connectors on the microcircuit module and the contact tracks are formed by a strip of a conductive adhesive material extending from the connectors to the contact tracks. Ideally the adhesive is an isotropic glue, that is conductive to electricity. |
申请公布号 |
DE69832104(T2) |
申请公布日期 |
2006.11.23 |
申请号 |
DE1998632104T |
申请日期 |
1998.03.09 |
申请人 |
GEMPLUS |
发明人 |
PATRICE, PHILIPPE;ZAFRANY, MICHAEL |
分类号 |
B42D15/10;G06K19/06;G06K19/077;H01L21/60;H01L23/498;H05K3/32 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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