发明名称 Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes
摘要 The electronic module has a support (40) which has contact tracks (46,48,50) formed on its underside. The microcircuit module (56) is fixed to the top side of the support and has output connectors (60,62) each connected to one of the tracks on the underside of the support. The connections between the connectors on the microcircuit module and the contact tracks are formed by a strip of a conductive adhesive material extending from the connectors to the contact tracks. Ideally the adhesive is an isotropic glue, that is conductive to electricity.
申请公布号 DE69832104(T2) 申请公布日期 2006.11.23
申请号 DE1998632104T 申请日期 1998.03.09
申请人 GEMPLUS 发明人 PATRICE, PHILIPPE;ZAFRANY, MICHAEL
分类号 B42D15/10;G06K19/06;G06K19/077;H01L21/60;H01L23/498;H05K3/32 主分类号 B42D15/10
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