发明名称 |
Stacking system and method |
摘要 |
A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack are at least two integrated circuit chip packages. The integrated circuit chip packages may be electrically connected to the first conductive pattern of the flex circuit such that the integrated circuit chip packages are positioned upon respective ones of opposed top and bottom surfaces of the flex substrate. Alternatively, one of the integrated circuit chip packages may be positioned upon the top surface of the flex substrate and electrically connected to the first conductive pattern, with the remaining integrated circuit chip package being attached in a non-conductive manner to the bottom surface of the flex substrate such that the conductive contacts of such integrated circuit chip package and the leads collectively define a composite footprint for the chip stack
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申请公布号 |
US2006261461(A1) |
申请公布日期 |
2006.11.23 |
申请号 |
US20060489956 |
申请日期 |
2006.07.20 |
申请人 |
ROETERS GLEN E;ROSS ANDREW C |
发明人 |
ROETERS GLEN E.;ROSS ANDREW C. |
分类号 |
H01L23/02;H01L23/538;H01L25/10 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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