| 摘要 |
A flattened contact cooling module for cooling an electronic element. The cooling module has a reduced height (thickness), such that the overall thickness of an electronic product is reduced. The cooling module includes a heat conducting plate having a sagged portion, an elastic member disposed on the heat conducting plate, and a first cooling device disposed on the sagged portion. The heat conducting plate is adhered to the electronic element, so as to effectively dissipate heat generated therefrom.
|
