发明名称 |
Method for mounting electronic parts onto a board |
摘要 |
Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently. |
申请公布号 |
US7137195(B2) |
申请公布日期 |
2006.11.21 |
申请号 |
US20040763495 |
申请日期 |
2004.01.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HAJI HIROSHI;HIDESE WATARU |
分类号 |
H05K3/30;H05K13/04;H01L21/00;H01L21/52;H01L21/68 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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