| 摘要 |
FIELD: reliable small-size microelectronic modules incorporating great number of integrated circuits. ^ SUBSTANCE: proposed method for producing three-dimensional hybrid integrated micromodule includes manufacture of flexible board in the form of strip carrying set of conductors for connection to IC contact pads and contact pads on one end of strip functioning as module lead, as well as projections arranged in staggered manner on two sides of strip and provided with seats to receive integrated circuits; projections carrying integrated circuits are bent onto strip at bending radius equal to conductor thickness as a minimum; strip is folded up and in zigzag manner in sequence affording coaxial disposition of integrated circuits one on top of other so that any risk of shorting out IC leads is eliminated and strip end carrying module leads is kept free; projections are glued to strip and to folded sections of strip, thickness of glue joint being not less than that of mentioned conductors. ^ EFFECT: enhanced reliability, packing density, productivity, and improved heat transfer. ^ 3 cl |
