| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin which can give a cured product with low moisture absorption and excellent transparency and heat discoloring resistance, to provide its production process, to provide an epoxy resin composition using the same, and to provide its cured product and photosemiconductor. <P>SOLUTION: The curing agent for epoxy resin comprises one or more acid anhydride expressed by general formula (I). A process is provided for producing the curing agent for the epoxy resin which hydrogenates one or more acid anhydride expressed by general formula (II) in the presence of a hydrogenation catalyst (wherein, R<SP>1</SP>in general formula (I) is an 8-20C saturated hydrocarbon group. R<SP>2</SP>in general formula (II) is a 8-20C hydrocarbon group, having at least one ≥1 C branched chain, and having at least one unsaturated carbon-carbon bond). <P>COPYRIGHT: (C)2007,JPO&INPIT |
