Method for local removal of covering compound e.g. for circuit board, has part-surface not to be processed covered with hole-mask

摘要

A method for local removal of covering compound (14) from a surface in which a part-surface not to be processed is covered with a hole-mask and a operational region (12) is defined by a part-surface of the hole-mask left vacant/free, and in which a part of the hole-mask (13) intervenes in the covering compound (14). An independent claim is also included for a device for carrying out the method.