发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment method and a plasma treatment device capable of plasma treatment of two or more faces of a treated material efficiently, and capable of preventing dirt and trash from adhering to the treated material by the plasma treatment. <P>SOLUTION: In a first step, a plasmatized treated gas 18 is made to flow out from at least two nearly oppositely arranged openings 14 to each other nearly toward a common region between the openings 14, respectively. In a second step, the openings 14 and the treated material 6 are made to relatively move in a nearly right angle direction to the direction in which the openings are nearly opposed to each other, the treated material 6 nearly goes in and comes out between the openings 14, and at this time, by making at least two faces 6a, 6b of the treated material 6 on nearly opposite side nearly oppose to the openings 14, respectively, the plasmatized treated gas 18 flowing out from the respective openings 14 is made to be contacted with the respective faces 6a, 6b of the treated material 6. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313670(A) 申请公布日期 2006.11.16
申请号 JP20050135406 申请日期 2005.05.06
申请人 SEKISUI CHEM CO LTD 发明人 IWANE KAZUYOSHI
分类号 H05H1/24 主分类号 H05H1/24
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