发明名称 |
Method for manufacturing electronic component-embedded printed circuit board |
摘要 |
Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently building up additional circuit layers.
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申请公布号 |
US2006258053(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20060431742 |
申请日期 |
2006.05.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE DOO H.;RYU CHANG S.;CHO HAN S.;MIN BYOUNG Y. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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