发明名称 Semiconductor device with decoupling capacitor and method of fabricating the same
摘要 The semiconductor device includes a semiconductor layer formed on a semiconductor substrate (e.g., SOI or HOT), and an opening exposing the semiconductor substrate through semiconductor layer. A decoupling capacitor is formed in the opening and includes an epitaxial layer formed in the opening on the semiconductor substrate, and a gate structure disposed on the epitaxial layer.
申请公布号 US2006255389(A1) 申请公布日期 2006.11.16
申请号 US20060392556 申请日期 2006.03.30
申请人 MAEDA SHIGENOBU 发明人 MAEDA SHIGENOBU
分类号 H01L29/94 主分类号 H01L29/94
代理机构 代理人
主权项
地址