| 摘要 |
<p>Provided is an adhesive sheet for dicing, which is attached to a semiconductor package before carrying out a dicing step, and causes no generation of thread-like chips during dicing of a silicon wafer. The adhesive sheet(10) for dicing comprises a substrate(11) and an adhesive layer(12) formed on at least one surface of the substrate, wherein the substrate has a multilayer structure having a layer containing an ethylene-based resin with a melting point of 95 deg.C or lower, and the above ethylene-based resin-containing layer has a thickness corresponding to at least 1/2 of the total thickness of the substrate. In the adhesive sheet, the ethylene-based resin preferably has a melt flow rate of 1.5g/10 minutes or more at 190 deg.C.</p> |
