发明名称 Semiconductor device and manufacturing method of the same
摘要 In a peripheral insulating film in a peripheral region, concave parts are provided. At least one of the concave parts is made to have an opening as a contact hole with an Al wiring layer, and a plurality of contact holes may be provided. Accordingly, frictions between the Al wiring layer and the peripheral insulating film are increased. Thus, occurrence of Al slide can be suppressed.
申请公布号 US2006255407(A1) 申请公布日期 2006.11.16
申请号 US20060409275 申请日期 2006.04.24
申请人 ISHIDA HIROYASU 发明人 ISHIDA HIROYASU
分类号 H01L27/12 主分类号 H01L27/12
代理机构 代理人
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