| 发明名称 |
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN EINRICHTUNG |
| 摘要 |
<p>The present invention provides for a method of providing copper metallization on a semiconductor body, including the step of depositing copper in a nitrogen-containing atmosphere so as to form a nitrogen-containing copper seed layer and forming the copper metallization on the seed layer, and also including the step of heating the seed layer so as to release the nitrogen to form part of a barrier layer separating the seed layer from the semiconductor body.</p> |
| 申请公布号 |
DE60215221(D1) |
申请公布日期 |
2006.11.16 |
| 申请号 |
DE2002615221 |
申请日期 |
2002.12.06 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
WOLTERS, A.;VAN GRAVEN-CLAASSEN, M. |
| 分类号 |
H01L21/28;H01L21/768;H01L21/285;H01L21/3205;H01L23/52;H01L23/532 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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