发明名称 |
TIN ALLOY SOLDER COMPOSITIONS |
摘要 |
<p>A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5.0% antimony; about 85% to about 99% tin and about 0.002% to about 1% of either nickel or cobalt. The alloy composition has a melting temperature of about 217° C, with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.</p> |
申请公布号 |
WO2006122240(A2) |
申请公布日期 |
2006.11.16 |
申请号 |
WO2006US18235 |
申请日期 |
2006.05.11 |
申请人 |
AMERICAN IRON & METAL COMPANY, INC.;SEELIG, KARL, F. |
发明人 |
SEELIG, KARL, F. |
分类号 |
C22C13/02 |
主分类号 |
C22C13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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